Boris Vaisband

I am an Assistant Professor at the University of California, Irvine, working on heterogeneous systems integration. In 2024 I was the Acting Director of UCLA CHIPS, and from 2019 to 2024, an Assistant Professor at McGill University. I received a B.S. degree in Computer Engineering from the Technion – Israel Institute of Technology in 2011, and M.S. and Ph.D. degrees in Electrical Engineering from the University of Rochester, NY, in, respectively, 2012 and 2017. From 2017 to 2019, I was a Postdoctoral Scholar at UCLA. From 2008 to 2015, I held various hardware design positions at Intel, Cisco, and Google. My current research interests are in heterogeneous integration, advanced packaging,  and neuromorphic systems, with a focus on circuits, EDA tools, and design methodologies for power delivery, communication, thermal aware design and floorplanning, and testing. Some applications of interest are ultra-large-scale artificial intelligence systems and high performance computing.

I am a senior member of the IEEE ('12), and a member of the IEEE Circuits and Systems Society ('16) and the IEEE Electronics Packaging Society ('18).