B. Vaisband (Keynote Speaker), “Chiplet-Based Heterogeneous Integration,” IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH), November 2021.

B. Vaisband, “Wafer-Scale Heterogeneous Integration,” IEEE Montreal Section Joint Chapter, EP21/EMC27, April 2021.

S. Iyer and B. Vaisband, “Silicon Interconnect Fabric – A Paradigm Shift in Heterogeneous Integration,” CMC Microsystems Webinar, June 2020.

B. Vaisband "Silicon Interconnect Fabric: A Versatile Heterogeneous Integration Platform," MiQro Innovation Collaborative Centre (C2MI), Bromont, QC, March 2020.

B. Vaisband, “Design of Ultra-Large Wafer-Level Systems,” International System-on-Chip Conference, University of California, Irvine CA, October 2018.

B. Vaisband, “A Network for Silicon Interconnect Fabric,” International Symposium on Microelectronics (IMAPS), Pasadena CA, October 2018.

B. Vaisband, “Silicon Interconnect Fabric: A Platform for Heterogeneous Integration,” ASCENT (an SRC JUMP Center) Annual Review, University of Notre Dame IN, August 2018.