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Electrical and Computer Engineering, McGill University
At THInK Team, we focus on enabling heterogeneous integration of systems. We deep dive into different integration platforms and generate design methodologies to increase system performance, reduce energy footprint, and enable novel applications.
RECENT EVENTS
Feb. 2023 - GLSVLSI will take place in June 2023. Call for papers is available here: https://www.glsvlsi.org/
Jan. 2023 - Fahad Amik has joined THInK Team. Fahad is currently working on ML-based EDA. Welcome!
Oct. 2022 - Boris is now a Professional Engineer licensed in Professional Engineering Ontario (PEO)
Sep. 2022 - Scott Fulton has joined THInK Team. Scott is currently working on ML-based multi-objective optimization. Welcome!
Boris has been elevated to Senior Member of IEEE
Congratulations to Jiaduo Xing for receiving the ReSMiQ undergraduate scholarship! Jiaduo will continue to do research at THInK Team working on characterization of communication for ultra-large scale systems.
Adam Corbier wins the SURE program best poster award in the "Information and Communications Technology" category for presenting his work on a "Compact Thermal Simulator for Chiplet-Based Integration Plarforms." Good job!
Congrats to Rezvan for presenting her prototype for an intelligent nail at the CMC-hosted TEXPO 2022 (co-located with IEEE NEWCAS). This work is supported by AIM Colours and Mitacs.
Mousa Karimi has joined THInK Team as a Postdoctoral Scholar. Mousa is currently working on neuromorphic circuits and architectures. Welcome!
Combining cosmetics and technology - a McGill article about the path of AIM Colours, our alum and collaborator.
https://www.mcgill.ca/channels/article/combining-cosmetics-and-technology
New paper published in TCPMT about ESD detection sensors.
https://ieeexplore.ieee.org/document/9780390
So nice to get positive feedback from a student!
"Thank you for making getting out of bed in the morning easier. Throughout a difficult semester personally, your class was a bright spot in my day. Thank you for the great semester, all the help outside of class, and for making me look forward to the lectures. They were some of the most fun and entertaining I've had, and the care you put in them really showed."
Ataollah Saeed Monir has joined THInK Team. Ata is currently working on neuromorphic circuits and architectures. Welcome!
Three papers accepted - Great work Yousef!
ECTC 2022 - collaborative work on hardware obfuscation using Si-IF.
ISQED 2022 - new power delivery methodology for 3D ICs.
ISCAS 2022 - power delivery methodologies for ultra-large-scale applications on Si-IF.
Very excited to be giving a Keynote Talk about Chiplet-Based Heterogeneous Integration at the 16th IEEE / ACM International Symposium on Nanoscale Architectures (NANOARCH). Please consider attending. http://nanoarch.ee.duth.gr/
NorCAS is coming up! The IEEE NorCAS conference is the main circuits and systems event of the Nordic countries representing both academia as well as electronics industry.
https://events.tuni.fi/norcas2021/
Dima Al Saleh has joined THInK Team. Dima is currently working on ML-assisted thermal-aware floorplanning in 3D ICs. Welcome!
Anja Kroon has joined THInK Team. Anja is joining as part of the Summer Undergraduate Research in Engineering (SURE) program at McGill. Anja will be working on power delivery in heterogeneous integration platforms. Welcome!
Allie D. Huerta has joined THInK Team. Allie is finishing her PhD in organic synthetic chemistry. She joined our team as part of a Mitacs project with AIM Colours to work on heterogeneous integration using flexible platforms. Welcome!
Miguel Morales Munoz has joined THInK Team. Miguel is pursuing his MEng. Welcome!
Joined as a member to the IEEE Council on Electronic Design Automation
Invited talk at the IEEE Montreal Section Joint Chapter, EP21/EMC27 on Wafer-Scale Heterogeneous Integration.
Joined as member to the IEEE CAS VLSI Systems & Applications Technical Committee (VSATC).
Received the Peter Silvester Faculty Research Award!
Paper accepted to ISCAS 2021 on power delivery topologies for the Si-IF platform. Good job Yousef!
Read our new patent about the Network on Interconnect Fabric (NoIF), published in December 2020.
Zahra Mohammadrezaee has joined THInK Team. Zahra is currently working on architecture and communication for the Silicon Interconnect Fabric platform. Welcome!
CMC-hosted webinar on Si-IF.
Invited talk at C2MI on the Si-IF - amazingly warm welcome!
Paper accepted to ISCAS 2020 on multi-bit CNT TSVs. See you in Spain.
An amazing workshop on heterogeneous integration at UCLA
New journal paper published in IEEE IBM Journal of R&D - seminal paper on the Si-IF technology.
Tenure-Track Assistant Professor at McGill University as of October 2019
New article in UCLA news: "Making More of Moore's Law"
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